Received supports and encourages from scholars, we are pleased to announce that 2013 International Conference on Mechanical Structures and Smart Materials is being organized and will be held on 16-17th November, 2013 in Xiamen, China.
ICMSSM 2013 aims at providing researchers, scientists, engineers and scholar students for presenting novel and fundamental advances in the fields of Mechanical Structures and Smart Materials. Authors are invited to contribute their papers, showcase their latest tools and techniques so as to promote the creation and exchange of ideas and the identification of new trends and required developments.
All accepted papers of ICMSSM 2013 will be published in "Applied Mechanics and Materials" [ISSN: 1660-9336, Trans Tech Publications].
Indexed by Elsevier: SCOPUS and Ei Compendex (CPX) , Cambridge Scientific Abstracts (CSA), Chemical Abstracts (CA), Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science), Institution of Electrical Engineers (IEE), etc. For Reference: http://www.ttp.net/1660-9336.html
ICMSSM 2013 invites authors to submit original and unpublished work. Papers should cover 4 pages formatted according to the Template. All submitted papers should be written in English. Submission implies the willingness of at least one of the authors to register the work. Papers should be submitted to us by two ways:
(1) Easy chair Submission System: http://www.easychair.org/conferences/?conf=icmssm2013
(2) email: email@example.com
Topics of interest include, but are not limited to:
1. The mechanical structure and mechanical engineering
2. Materials Science and Engineering
3. Materials Manufacturing and Processing
Paper Submission (Full Paper): Oct 9, 2013
Notification of Acceptance: Oct 16, 2013
Authors' Registration & Payment: Oct 23, 2013
Conference Date: Nov 16-17, 2013
Tel ： +86-24-83958169-801 Ms.Ji
Q Q : 2947191913